Cooler Master Thermal Pad 1.5 mm High Performance Thermal Pad, High Conductivity W/m.k= 13.3m, Nano Elements Rapid Cooling, Double-sided Adhesive for a wide range of Electronics and Devices

Cooler Master Thermal Pad 1.5 mm High Performance Thermal Pad, High Conductivity W/m.k= 13.3m, Nano Elements Rapid Cooling, Double-sided Adhesive for a wide range of Electronics and Devices

by Cooler Master

Availability: In Stock.

$15.90

Select Variant: Cooler Master Thermal Pad 1.5 mm High Performance Thermal Pad, High Conductivity W/m.k= 13.3m, Nano Elements Rapid Cooling, Double-sided Adhesive for a wide range of Electronics and Devices

Cooler Master Thermal Pad 1.0 mm High Performance Thermal Pad, Conductivity W/m.k= 13.3m, Nano Elements Rapid Cooling, Double-Sided Adhesive for Electronics and Devices (TPX-NOPP-9010-R1)

Cooler Master Thermal Pad 2.0 mm High Performance Thermal Pad, High Conductivity W/m.k= 13.3m, Nano Elements Rapid Cooling, Double-Sided Adhesive for a Wide Range of Electronics and Devices

Cooler Master Thermal Pad 0.5 mm High Performance Thermal Pad, High Conductivity W/m.k= 13.3m, Nano Elements Rapid Cooling, Double-Sided Adhesive for a Wide Range of Electronics and Devices

Cooler Master Thermal Pad 3.0 mm High Performance Thermal Pad, Conductivity W/m.k= 13.3m, Nano Elements Rapid Cooling, Double-Sided Adhesive for Electronics and Devices (TPX-NOPP-9030-R1)

* Price as of 2023-04-07 06:22 CET -

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Product Features

Formulated with Nano Elements: Nano zinc oxide and nano alumina particles deliver a thermal conductivity of 13.3 w/mK for rapid cooling, suitable for a wide range of electronics and devices.
Non-toxic and Non-corrosive: Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening
Double-sided Adhesive: Provides seamless and secure contact between surfaces
Versatile and Easy Application: Easily cut to the perfect size for your application