Enzotech SLF-1 Pure Copper, Low Profile Heat Sink

by Enzotech
Availability: Currently Unavailable
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Product Features

  • Multiple push pin locations for universal mounting on various board assembly. (hole to hole distance 54.6mm and 59m)
  • Formed of pure copper for enhanced thermal conductivity.
  • Excellent surface flatness minimizes the interface between the heat source and heat sink.
  • Includes Thermal Compound

Product Details

BrandEnzotech
SKUB0014T161S
ModelSLF-1
MPNSLF-1
EAN 4712558091039

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